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  creat by art ? glass passivated chip junction ? for surface mounted application ? low profile package ? built-in strain relief ? ideal for automated placement ? easy pick and place ? ultrafast recovery time for high efficiency ? low forward voltage, low power loss us1x = specific device code g = green compound y = year ww = work week maximum ratings and electrical characteristics rating at 25 ambient temperature unless otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load, derate current by 20% symbol US1A us1b us1d us1g us1j us1k us1m unit v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v trr ns cj pf t j o c t stg o c 30 a ? high temperature soldering guaranteed: 260 /10 seconds on terminals 15 10 type number note 1: pulse test with pw=300 usec, 1% duty cycle maximum rms voltage maximum dc blocking voltage US1A - us1m 1.0amp. high efficient surface mount rectifiers marking diagram sma/do-214ac dimensions in inches and (millimeters) i f(av) 1a ? weight: 0.064 grams features ? polarity: indicated by cathode band note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. operating temperature range storage temperature range - 55 to + 150 typical thermal resistance version:g11 - 55 to + 150 typical junction capacitance (note 3) note 2: reverse recovery test conditions: if=0.5a, ir=1.0a, irr=0.25a r ja r jl 75 27 o c/w maximum reverse recovery time (note 2) maximum reverse current @ rated vr t a =25 t a =125 i r maximum repetitive peak reverse voltage maximum instantaneous forward voltage (note 1) @ 1 a v f maximum average forward rectified current peak forward surge current, 8.3 ms single half sine- wave superimposed on rated load (jedec method) i fsm ? plastic material used carries underwriters laboratory classification 94v-0 ? case: molded plastic ? terminals: solder plated, solderable per mil-std-750, method 2026 mechanical data ? green compound with suffix "g" on packing code & prefix "g" on datecode 1.7 v 50 75 5 150 ua 1.0 pb rohs compliance ro h s co m p lia nce http://
version:g11 ratings and characteristic curves (US1A thru us1m) fig.1 maximum forward current derating curve 0 0.5 1 1.5 0 25 50 75 100 125 150 175 lead temperature ( o c) averag e f o rward current ( a ) resistive or inductive fig. 2 maximum non-repetitive forward surge current 0 10 20 30 40 50 1 10 100 number of cycles at 60 hz peak fo rw ard surg e a current ( a ) 8.3ms single half sine wave jedec method fig. 4 typical reverse characteristics 0.01 0.1 1 10 100 0 2 04 0 608 0 100 percent of rated peak reverse voltage (%) i n st ant a neo u s reverse current ( u a) ta=25 ta=100 fig. 5 typical junction capacitance 1 10 100 0.1 1 1 0 100 reverse voltage (v) capaci t ance ( p f ) ta=25 f=1.0mhz vsig=50mvp-p US1A-us1g us1j-us1m fig. 3 typical forward characterisrics 0.001 0.01 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 forward voltage (v) i n stantaneous forward current (a) us1j-us1m US1A-us1g pulse width=300us 1% duty cycle fig. 6 typical transient thermal impedance 0.1 1 10 100 0.01 0.1 1 10 100 t-pulse duration(s) t r ansi ent t h erm a l i m pedance a ( /w )


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